Display device

ABSTRACT

According to one embodiment, a display device includes a first insulating substrate including a first substrate end, a second insulating substrate including an outer surface and a second substrate end, an electrode located between the first substrate end and the second substrate end, and a transparent conductive layer disposed on a side on which the outer surface is located. The outer surface includes a flat portion and a sloping portion. A thickness on a side on which the second substrate end is located is less than a thickness on a side on which the flat portion is located. The transparent conductive layer overlaps the sloping portion and is electrically connected to the electrode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation Application of PCT Application No.PCT/JP2019/023385, filed Jun. 12, 2019 and based upon and claiming thebenefit of priority from Japanese Patent Application No. 2018-161676,filed Aug. 30, 2018, the entire contents of all of which areincorporated herein by reference.

FIELD

Embodiments described herein relate generally to a display device.

BACKGROUND

Recently, in a lateral electric field type liquid crystal displaydevice, from the perspective of static buildup prevention or the like, atechnology of electrically connecting a transparent conductive filmdisposed on a surface of one substrate and an electrode of a groundpotential disposed in the other substrate by a conductive member hasbeen known. A polarizer is disposed on the transparent conductive film.When the polarizer expands, the polarizer and the conductive membercontact each other, and the contact area between the conductive memberand the transparent conductive film may be reduced. In particular, inassociation with the demand for a narrower frame, the polarizer and theconductive member tend to be disposed close to each other, and areaffected easily even by slight expansion of the polarizer.

SUMMARY

The present disclosure relates generally to a display device.

According to one embodiment, a display device includes a firstinsulating substrate including a first substrate end, a secondinsulating substrate including an outer surface and a second substrateend, an electrode located between the first substrate end and the secondsubstrate end, and a transparent conductive layer disposed on a side onwhich the outer surface is located. The outer surface includes a flatportion and a sloping portion. A thickness on a side on which the secondsubstrate end is located is less than a thickness on a side on which theflat portion is located. The transparent conductive layer overlaps thesloping portion and is electrically connected to the electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the external appearance of a displaydevice DSP.

FIG. 2A is a cross-sectional view of a display panel PNL in the firstembodiment along line A-B shown in FIG. 1.

FIG. 2B is another cross-sectional view of the display panel PNL alongline A-B shown in FIG. 1.

FIG. 3 is another cross-sectional view of the display panel PNL alongline A-B shown in FIG. 1.

FIG. 4 is a cross-sectional view of a display panel PNL in the secondembodiment.

FIG. 5 is another cross-sectional view of the display panel PNL in thesecond embodiment.

FIG. 6 is a cross-sectional view of a display panel PNL in the thirdembodiment.

FIG. 7 is another cross-sectional view of the display panel PNL in thethird embodiment.

FIG. 8 is a cross-sectional view of a display panel PNL in the fourthembodiment.

FIG. 9 is another cross-sectional view of the display panel PNL in thefourth embodiment.

FIG. 10 is a plan view of a display panel PNL in the fifth embodiment.

FIG. 11 is a cross-sectional view of the display panel PNL along lineC-D shown in FIG. 10.

FIGS. 12A to 12D are illustrations for explaining the first formationmethod of a sloping portion 22.

FIG. 13 is an illustration showing a formation example of the slopingportion 22.

FIG. 14 is an illustration showing another formation example of thesloping portion 22.

FIG. 15 is an illustration showing another formation example of thesloping portion 22.

DETAILED DESCRIPTION

In general, according to one embodiment, there is provided a displaydevice comprising: a first insulating substrate comprising a firstsubstrate end; a second insulating substrate comprising an inner surfaceopposed to the first insulating substrate, an outer surface on anopposite side to the inner surface, and a second substrate end; anelectrode located between the first substrate end and the secondsubstrate end and maintained at a predetermined potential; and atransparent conductive layer disposed on a side on which the outersurface is located. The outer surface comprises a flat portion and asloping portion formed from the flat portion to the second substrateend. The sloping portion slopes such that a thickness on a side on whichthe second substrate end is located is less than a thickness on a sideon which the flat portion is located. The transparent conductive layeroverlaps the sloping portion and is electrically connected to theelectrode.

Embodiments will be described hereinafter with reference to theaccompanying drawings. The disclosure is merely an example, and properchanges in keeping with the spirit of the invention, which are easilyconceivable by a person of ordinary skill in the art, come within thescope of the invention as a matter of course. In addition, in somecases, in order to make the description clearer, the widths,thicknesses, shapes and the like, of the respective parts areillustrated schematically in the drawings, rather than as an accuraterepresentation of what is implemented. However, such schematicillustration is merely exemplary, and in no way restricts theinterpretation of the invention. In addition, in the specification anddrawings, constituent elements which function in the same or a similarmanner to those described in connection with preceding drawings aredenoted by the same reference numbers, and detailed description of themwhich is considered redundant may be arbitrarily omitted.

In the embodiments, a liquid crystal display device will be described asan example of a display device DSP. The main configuration disclosed inthe embodiments can also be applied to a self-luminous display devicecomprising an organic electroluminescent display element or the like, anelectronic paper display device comprising an electrophoretic element orthe like, a display device employing micro-electromechanical systems(MEMS), a display device employing electrochromism, and the like.

First Embodiment

FIG. 1 is a plan view showing the external appearance of a displaydevice DSP. In one example, a first direction X, a second direction Yand a third direction Z are orthogonal to one another. However, they maycross one another at an angle other than 90 degrees. The first directionX and the second direction Y correspond to directions parallel to themain surface of a substrate constituting the display device DSP, and thethird direction Z corresponds to the thickness direction of the displaydevice DSP. For example, the first direction X corresponds to the shortside direction of the display device DSP, and the second direction Ycorresponds to the long side direction of the display device DSP. In thespecification, an observation position from which the display device DSPis observed is assumed to be located on a side on which the tip of anarrow indicating the third direction Z is located, and viewing toward anXY-plane defined by the first direction X and the second direction Yfrom this observation position is referred to as planar view.

The display device DSP comprises a display panel PNL, a flexible printedcircuit board 1, an IC chip 2 and a circuit board 3.

The display panel PNL is, for example, a liquid crystal display panel,and comprises a first substrate SUB1, a second substrate SUB2, and aliquid crystal layer LC which will be described later. The display panelPNL comprises a display portion DA which displays an image, and aframe-shaped non-display portion NDA which surrounds the display portionDA. The first substrate SUB1 comprises a first region A1 and a secondregion A2 which are arranged in the second direction Y. The secondsubstrate SUB2 overlaps the first substrate SUB1 in the first region A1but does not overlap the second region A2. The display portion DA isincluded in the first region A1.

The display portion DA comprises a plurality of pixels PX disposed in amatrix in the first direction X and the second direction Y. The pixel PXhere indicates a minimum unit which can be individually controlledaccording to a pixel signal, and is referred to also as a sub-pixel. Thepixel PX is, for example, any of a red pixel which displays red, a greenpixel which displays green, a blue pixel which displays blue, and awhite pixel which displays white.

The flexible printed circuit board 1 is mounted on the second region A2and is electrically connected to the circuit board 3. The IC chip 2 ismounted on the flexible printed circuit board 1. However, the IC chip 2may be mounted on the second region A2. The IC chip 2 includes abuilt-in display driver DD. The display driver DD outputs a signalrequired for image display in an image display mode of displaying animage. In the example shown in FIG. 1, the IC chip 2 includes a built-intouch controller TC. The touch controller TC controls a touch sensingmode of detecting approach an object to or contact of an object with thedisplay device DSP.

The first substrate SUB1 comprises an electrode EL in the second regionA2. The electrode EL is, for example, grounded via the flexible printedcircuit board 1 but only has to be maintained at a predeterminedpotential. The predetermined potential is supplied to the electrode by aDC current having a ground potential or a fixed potential of severalvolts or an AC current having a predetermined amplitude. In the exampleshown in FIG. 1, the electrode EL is disposed in two places across theflexible printed circuit board 1. However, the electrode EL may bedisposed in only one place or three or more places.

The second substrate SUB2 comprises a transparent conductive film CL asan example of a transparent conductive layer. The transparent conductivefilm CL is disposed over substantially the entire surface of the secondsubstrate SUB1 and overlaps the display portion DA. The transparentconductive film CL is formed of a transparent conductive material suchas indium tin oxide (ITO) or indium zinc oxide (IZO).

An optical element OD2 overlaps the transparent conductive film CL. Inaddition, the optical element OD2 overlaps the display portion DA andextends to the non-display portion NDA.

A connection member CN is located in the non-display portion NDA andelectrically connects the electrode EL and the transparent conductivefilm CL. The connection member CN is formed of, for example, a resinmaterial having conductivity.

FIG. 2A is a cross-sectional view of the display panel PNL in the firstembodiment along line A-B shown in FIG. 1. Note that only theconfiguration required for explanation is illustrated here, and thefirst substrate SUB1 and the second substrate SUB2 are simplified. Inthe specification, a direction from the first substrate SUB1 toward thesecond substrate SUB2 is referred to as an upper side (or simply asabove), and a direction from the second substrate SUB2 toward the firstsubstrate SUB1 is referred to as a lower side (or simply as below). Whendescribed as the second member above the first member and the secondmember below the first member, the second member may be in contact withthe first member or apart from the first member.

In the display panel PNL, the liquid crystal layer LC is located betweenthe first substrate SUB1 and the second substrate SUB2. The firstsubstrate SUB1 comprises a first insulating substrate 10, a circuitelement 11, the electrode EL and the like. The second substrate SUB2comprises a second insulating substrate 20 opposed to the firstinsulating substrate 10, a light-shielding layer LS and the like. Thefirst insulating substrate 10 and the second insulating substrate 20 aretransparent substrates such as glass substrates or flexible resinsubstrates.

The first insulating substrate 10 comprises an inner surface 10A opposedto the second insulating substrate 20, an outer surface 10B on anopposite side to the inner surface 10A, and a first substrate end 10C.The circuit element 11 is disposed on the inner surface 10A, andincludes a scanning line, a signal line, a switching element, a pixelelectrode, a common electrode, an inorganic insulating film, an organicinsulating film, an alignment film and the like.

The second insulating substrate 20 comprises an inner surface 20Aopposed to the first insulating substrate 10 in the first region A1, anouter surface 20B on an opposite side to the inner surface 20A, and asecond substrate end 20C. The second substrate end 20C is located at theboundary between the first region A1 and the second region A2. Thelight-shielding layer LS is disposed on the inner surface 20A and islocated in the non-display portion NDA. The boundary between the displayportion DA and the non-display portion NDA is defined by, for example,an inner circumferential portion LSI of the light-shielding layer LS. Asealant SE is located in the non-display portion NDA, and bonds thefirst substrate SUB1 and the second substrate SUB2 together and seals inthe liquid crystal layer LC. The sealant SE is disposed at a positionoverlapping the light-shielding layer LS.

The electrode EL is located between the first substrate end 10C and thesecond substrate end 20C. In addition, the electrode EL is located onthe first insulating substrate 10 in the second region A2. The secondsubstrate SUB2 is not disposed on the electrode EL.

The transparent conductive film CL is disposed on the outer surface 20Band is disposed over the display portion DA and the non-display portionNDA. The optical element OD2 including a polarizer PL2 is bonded to thetransparent conductive film CL by a transparent adhesive layer AD. Anoptical element OD1 including a polarizer PL1 is bonded to the outersurface 10B, but illustration of an adhesive layer is omitted. Each ofthe optical elements OD1 and DO2 may comprise a retarder, a scatteringlayer, an antireflective layer or the like as needed.

The connection member CN is superposed above the light-shielding layerLS in the second substrate SUB2 and is in contact with the transparentconductive film CL. The connection member CN is in contact with theelectrode EL in the first substrate SUB1. The connection member CN is incontact with the second substrate end 20C and is disposed continuouslybetween the transparent conductive film CL and the electrode EL.Accordingly, the transparent conductive film CL and the electrode EL areelectrically connected via the connection member CN.

Now, attention is focused on the outer surface 20B. The outer surface20B comprises a flat portion 21 and a sloping portion 22. The flatportion 21 overlaps the display portion DA and is a flat surface formedalong the XY-plane. The sloping portion 22 overlaps the non-displayportion NDA and is located between the flat portion 21 and the secondsubstrate end 20C. The sloping portion 22 has a thickness T1 in thevicinity of the flat portion 21 and a thickness T2 in the vicinity ofthe second substrate end 20C. Note that a thickness in the specificationis a length along the third direction Z.

The thickness T2 is less than the thickness T1. In addition, thedifference between a thickness T0 in the flat portion 21 and thethickness T2 is, for example, greater than or equal to 0.1 mm, and thethickness T2 is less than or equal to ½ of the thickness T0. In otherwords, the second insulating substrate 20 comprises a tapered portion inwhich the thickness decreases toward the second substrate end 20C (orthe electrode EL) in the non-display portion NDA.

Now, attention is focused on the relationship between a width LY of thesloping portion 22 and a height LZ of the sloping portion 22. The widthLY corresponds to the length along the second direction Y of the slopingportion 22. The height LZ corresponds to the length LZ along the thirddirection Z of the sloping portion 22. In one example, in the slopingportion 22 shown by a solid line, the width LY is equal to the height LZor greater than the height LZ (LY≥LZ). In addition, in another example,the sloping portion 22 may be formed in a shape shown by a dasheddouble-dotted line. In this case, the width LY is less than the heightLZ (LY<LZ).

In the illustrated example, the sloping portion 22 is a flat surfacecrossing both the second direction Y and the third direction Z andhardly comprise projections and depressions. However the sloping portion22 may be a surface having projections and depressions along the thirddirection Z. In addition, the sloping portion 22 may be a curvedsurface. Furthermore, the sloping portion 22 may be a flat surfacecrossing all the first direction X, the second direction Y and the thirddirection Z.

The inner surface 20A is a flat surface formed along the XY-plane in thedisplay portion DA and the non-display portion NDA, and is opposed tothe flat portion 21 and the sloping portion 22.

The transparent conductive film CL is disposed continuously in contactwith both the flat portion 21 and the sloping portion 22. In theillustrated example, the transparent conductive film CL is locatedbetween the sloping portion 22 and the connection member CN. In thefirst embodiment, the transparent conductive film CL is electricallyconnected to the electrode EL via the connection member CN. However, aswill be described later, the transparent conductive film CL may bedirectly in contact with the electrode EL and electrically connected tothe electrode EL. In addition, the transparent conductive film CL may beapart from the sloping portion 22, and the transparent conductive filmCL only has to be superposed above the sloping portion 22 in the thirddirection Z.

An end ODE of the optical element OD2 and an end ADE of the adhesivelayer AD are located in the non-display portion NDA. In the illustratedexample, the end ODE and the end ADE are superposed above the flatportion 21. However, they may be superposed above the sloping portion22, above the second substrate end 20C, or between the first substrateend 10C and the second substrate end 20C. However, the adhesive layer ADis apart from the transparent conductive film CL above the slopingportion 22 and does not interfere with the contact between theconnection member CN and the transparent conductive film CL.

FIG. 2B is another cross-sectional view of the display panel PNL alongline A-B shown in FIG. 1. The example shown in FIG. 2B is different fromthe example shown in FIG. 2A in that a thickness T10 of the firstinsulating substrate 10 is greater than the thickness T0 in the flatportion 21 of the second insulating substrate 20 (T10>T0). The otherconfiguration is the same as that of the example shown in FIG. 2A, andthe constituent elements are denoted by the same reference numbers, anddetailed description of them is omitted.

FIG. 3 is another cross-sectional view of the display panel PNL alongline A-B shown in FIG. 1. The illustrated cross-sectional view shows astate where the optical element OD2 and the adhesive layer AD shown inFIG. 2A expand along the second direction Y, for example. As indicatedby an arrow YA in FIG. 3, when the optical element OD2 and the adhesivelayer AD expand along the second direction Y, the optical element OD2and the adhesive layer AD may be superposed above the sloping portion22.

In a comparative example where the second insulating substrate 20 doesnot comprise the sloping portion 22, when the optical element OD2 andthe adhesive layer AD expand in the direction of the arrow YA, theconnection member CN is pushed out in the direction of the arrow YA, andthe contact area between the transparent conductive film CL and theconnection member CN may be reduced.

On the other hand, according to the first embodiment, even when theoptical element OD2 and the adhesive layer AD expand in the direction ofthe arrow YA, the connection member CN contacting the transparentconductive film CL in the sloping portion 22 hardly moves. Therefore,the reduction of the contact area between the transparent conductivefilm CL and the connection member CN is suppressed. Accordingly, poorconnection associated with the reduction of the contact area between thetransparent conductive film CL and the connection member CN can besuppressed. Consequently, the reduction of reliability can besuppressed.

In addition, the transparent conductive film CL is disposed in thesloping portion 22 in which the thickness decreases toward the electrodeEL, and the difference in level along the third direction Z between thetransparent conductive film CL and the electrode EL is reduced.Therefore, the disconnection due to level difference of the connectionmember CN disposed over the transparent conductive film CL and theelectrode EL can be suppressed.

Furthermore, a discharge path can be formed from the transparentconductive film CL to the electrode EL of the ground potential via theconnection member CN, and the static buildup of the second substrateSUB2 can be suppressed. Accordingly, the reduction of display qualitydue to static buildup can be suppressed.

Other embodiments will be described below. In each of the embodiments,only the configuration required for explanation will be illustrated andexplained.

Second Embodiment

FIG. 4 is a cross-sectional view of the display panel PNL in the secondembodiment. The second embodiment is different from the first embodimentin that the end ODE of the optical element OD2 projects more toward theelectrode EL than the end ADE of the adhesive layer AD. That is, a spaceSP is formed between the transparent conductive film CL and the opticalelement OD2. The space SP is filled with the connection member CN, andthe connection member CN is in contact with the transparent conductivefilm CL directly below the optical element OD2. The ends ODE and ADE areboth located in the non-display portion NDA.

As compared with the first embodiment in which the end ADE is locateddirectly below the end ODE, the contact area between the connectionmember CN and the transparent conductive film CL is increased.

FIG. 5 is another cross-sectional view of the display panel PNL in thesecond embodiment. Even when the optical element OD2 and the adhesivelayer AD expand, the end ODE projects more toward the electrode EL thanthe end ADE. Therefore, the connection member CN remains between the endODE and the end ADE, and the reduction of the volume of the connectionmember CN contacting the transparent conductive film CL is suppressed,and the increase of the electrical resistance of the connection memberCN is suppressed.

Third Embodiment

FIG. 6 is a cross-sectional view of the display panel PNL in the thirdembodiment. The third embodiment is different from the first embodimentin comprising a low expansion layer LE between the adhesive layer AD andthe optical element OD2. The thermal expansion coefficient of the lowexpansion layer LE is less than the thermal expansion coefficient of theoptical element OD2. The low expansion layer LE is transparent and hasoptical isotropy (the retardation in the XY-plane is zero). For example,the low expansion layer LE is a support which supports a polarizationlayer and a retardation layer constituting the optical element OD2.

As compared with the first embodiment which does not comprise the lowexpansion layer LE, the optical element OD2 is disposed more upward, andthe contact area between the end ODE and the connection member CN isreduced.

FIG. 7 is another cross-sectional view of the display panel PNL in thethird embodiment. Even when the optical element OD2 expands, the amountof expansion of the low expansion layer LE and the adhesive layer AD isless than the amount of expansion of the optical element OD2. Inaddition, since the contact area between the end ODE and the connectionmember CN is reduced, the amount of pushing out of the connection memberCN associated with expansion of the optical element OD2 is reduced.

Fourth Embodiment

FIG. 8 is a cross-sectional view of the display panel PNL in the fourthembodiment. The fourth embodiment is different from the first embodimentin that the optical element OD2 comprises a conductive adhesive agent CAwhich is another example of a transparent conductive layer. The adhesiveagent CA contacts the flat portion 21 and bonds the optical element OD2to the flat portion 21. In addition, the adhesive agent CA is apart fromthe sloping portion 22 above the sloping portion 22. The connectionmember CN is located between the sloping portion 22 and the adhesiveagent CA. That is, the adhesive agent CA of the fourth embodiment hasthe functions of both the transparent conductive film CL and theadhesive layer AD in the first embodiment. The adhesive agent CA is aconductive adhesive agent obtained by dispersing particles in anadhesive agent or the like. The adhesive agent CA is in contact with alower surface ODB of the optical element OD2. The end ODE and an end CAEof the adhesive agent CA overlap the sloping portion 22 across theconnection member CN.

FIG. 9 is another cross-sectional view of the display panel PNL in thefourth embodiment. When the optical element OD2 and the adhesive agentCA expand, in particular, in a region overlapping the sloping portion22, an area in which the adhesive agent CA overlaps the sloping portion22 increases according to the expansion. At this time, the connectionmember CN disposed in the sloping portion 22 hardly moves. Therefore,when the optical element OD2 and the adhesive agent CA expand, thecontact area between the adhesive agent CA and the connection member CNincreases, and reliability improves.

In addition, the adhesive agent CA has the functions of both thetransparent conductive film for static buildup prevention and theadhesive layer of the optical element OD2. Therefore, the display panelPNL is made thinner, and the number of components can be reduced.Furthermore, as compared with when the transparent conductive film isformed separately by depositing a transparent conductive material, theformation cost of the transparent conductive film can be reduced.

Furthermore, although the first embodiment shown in FIG. 3 requires theregion for disposing the connection member CN between the end ODE of theoptical element OD2 and the second substrate end 20C along the seconddirection Y, the fourth embodiment does not require the region fordisposing the connection member CN between the end ODE and the secondsubstrate end 20C. Therefore, as compared with the first embodiment, thefourth embodiment can achieve an even narrower frame.

Fifth Embodiment

FIG. 10 is a plan view of the display panel PNL in the fifth embodiment.The optical element OD2 applied to the fifth embodiment comprises a mainbody MP and an extension portion EP. The main body MP is superposedabove the second substrate SUB2. The extension portion EP extendsbetween the first substrate end 10C and the second substrate end 20C andis superposed above the electrode EL.

FIG. 11 is a cross-sectional view of the display panel PNL along lineC-D shown in FIG. 10. Similarly to the fourth embodiment, the adhesiveagent CA bonds the optical element OD2 to the second substrate SUB2 andthe electrode EL. The adhesive agent CA is disposed continuously incontact with the flat portion 21, the sloping portion 22 and theelectrode EL. The adhesive agent CA bonds the main body MP to the flatportion 21 and the sloping portion 22. In addition, the adhesive agentCA bonds the extension portion EP to the electrode EL between the firstsubstrate end 10C and the second substrate end 20C.

Even when the optical element OD2 expands, the contact area between theadhesive agent CA and the electrode EL hardly changes.

In addition, the adhesive agent CA has the functions of the transparentconductive film for static buildup prevention, the adhesive layer of theoptical element OD2, and the connection member connected to theelectrode EL. Therefore, the number of components can be reduced.Furthermore, as compared with when the transparent conductive materialand the connection member are formed separately, the cost can bereduced.

<<First Formation Method of Sloping Portion>>

Now, the first formation method of the sloping portion 22 will bedescribed with reference to FIGS. 12A to 12D. Only the main parts of thefirst substrate SUB1 and the second substrate SUB2 are illustrated here.

As shown in FIG. 12A, in a mother substrate MSUB composed of the firstsubstrate SUB1 and the second substrate SUB2 bonded together, laserlight is emitted from the outer surface 20B side of the secondinsulating substrate 20, and the laser light is condensed inside thesecond insulating substrate 20. As the light source at this time, fromthe perspective of hardly damaging the periphery of a condensing part20X of laser light either thermally or chemically, a femtosecond laserdevice which emits laser light having a pulse width of femtoseconds ispreferable. As the laser light is emitted, the condensing part 20X ismodified. In addition, the condensing part 20X is formed in a pluralityof places, and for example, from the liquid crystal layer LC toward theelectrode EL along the second direction Y, the condensing part 20X isformed such that it recedes from the first substrate SUB1 along thethird direction Z.

Then, as shown in FIG. 12B, the first insulating substrate 10 and thesecond insulating substrate 20 are reduced in thickness. For example,the first insulating substrate 10 and the second insulating substrate 20are glass substrates, and are reduced in thickness by dissolution by anetching solution such as a hydrofluoric acid (HF) solution. In addition,the condensing part 20X shown in FIG. 12A is dissolved by the etchingsolution more easily than a part of glass in which the laser light isnot condensed. Therefore, when the condensing part 20 is exposed to theetching solution in association with the reduction of the thickness ofthe second insulating substrate 20, a concave portion CC depressedtoward the first insulating substrate 10 is formed on the outer surface20B.

Then, as shown in FIG. 12C, the transparent conductive film CL is formedby depositing a transparent conductive material on the entire surface ofthe outer surface 20B including the concave portion CC.

Then, as shown in FIG. 12D, a part of the second insulating substrate 20which is opposed to the electrode EL is removed. Accordingly, the secondinsulating substrate 20 comprising the flat portion 21 and the slopingportion 22 is formed.

After that, although not illustrated, the optical element OD2 is bondedto the transparent conductive film CL by the adhesive layer AD. Afterthat, a resin material having conductivity is applied continuously fromthe transparent conductive film CL above the sloping portion 22 to theelectrode EL. The cured resin material corresponds to the connectionmember CN described above. Accordingly, the transparent conductive filmCL and the electrode EL are electrically connected by the connectionmember CN. The display panels PNL of the first to third embodimentsdescribed above are obtained by applying the first formation methoddescribed here.

In addition, the deposition process of the transparent conductivematerial described in FIG. 12C may be omitted, and the optical elementOD2 may be bonded to the flat portion 21 by the adhesive agent CA, andthe connection member CN may be formed between the adhesive agent CA andthe electrode EL. The display panel PNL of the fourth embodimentdescribed above can be obtained by applying this formation method.

Furthermore, not only the deposition process of the transparentconductive material described in FIG. 12C but also the formation processof the connection member CN may be omitted, and the main body MP of theoptical element OD2 may be bonded to the flat portion 21 and the slopingportion 22 and the extension portion EP may be bonded to the electrodeEL by the adhesive agent CA. The display panel PNL of the fifthembodiment described above can be obtained by applying this formationmethod.

The sloping portion 22 is a portion sloping downward from the flatportion 21 toward the second substrate end 20C in the second insulatingsubstrate 22, and includes not only a sloping portion having a flatsloping surface but also a sloping portion having a sloping surfacewhich is made slightly bumpy or uneven by the first formation method orthe like.

<<Second Formation Method of Sloping Portion>>

In the second formation method, the sloping portion 22 is formed bymechanically grinding the second insulating substrate 20 by a grindstoneor the like. This sloping portion 22 is formed such that it is adjacentto the electrode EL in the second direction Y.

In the example shown in FIG. 13, the sloping portion 22 is formed in asubstantially rectangular shape. This sloping portion 22 is a surfacecrossing both the second direction Y and the third direction Z andextending parallel to the first direction X. A boundary B between theflat portion 21 and the sloping portion 22 extends along the firstdirection X in the XY-plane. A thickness T along the third direction Zof the sloping portion 22 decreases from the flat portion 21 toward theelectrode EL along the second direction Y. Note that the thickness T ofthe sloping portion 22 is substantially constant along the firstdirection X.

In the example shown in FIG. 14, the sloping portion 22 is formed in asubstantially triangular shape. This sloping portion 22 is a surfacecrossing all the first direction X, the second direction Y and the thirddirection Z. The boundary B between the flat portion 21 and the slopingportion 22 crosses both the first direction X and the second direction Yin the XY-plane. The thickness T of the sloping portion 22 decreasesfrom the flat portion 21 toward the electrode EL along the firstdirection X and the second direction Y.

In the example shown in FIG. 15, the first insulating substrate 10 andthe second insulating substrate 20 comprise concave portions C1 and C2,respectively. The concave portions C1 and C2 are formed in a regiondifferent from a region in which the flexible printed circuit board 1 ismounted. The sloping portion 22 is disposed in the concave portion C2.This sloping portion 22 is formed, for example, in a grinding process offorming the concave portions C1 and C2.

After the sloping portion 22 described with reference to FIGS. 13 to 15is formed, the display panels PNL of the first to third embodimentsdescribed above are obtained by forming the transparent conductive filmCL on the flat portion 21 and the sloping portion 22, bonding theoptical element OD2 to the transparent conductive film CL by theadhesive layer AD, and electrically connecting the transparentconductive film CL and the electrode EL by the connection member CN.

In addition, after the sloping portion 22 is formed, the display panelPNL of the fourth embodiment described above is obtained by bonding theoptical element OD2 to the flat portion 21 by the adhesive agent CA, andforming the connection member CN between the adhesive agent CA and theelectrode EL.

Furthermore, after the sloping portion 22 is formed, the display panelPNL of the fifth embodiment described above is obtained by bonding themain body MP of the optical element OD2 to the flat portion 21 and thesloping portion 22, and bonding the extension portion EP to the endportion EL.

As described above, according to the embodiments, a display device whichcan suppress reduction of reliability can be provided.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A display device comprising: a first insulatingsubstrate comprising a first substrate end; a second insulatingsubstrate comprising an inner surface opposed to the first insulatingsubstrate, an outer surface on an opposite side to the inner surface,and a second substrate end; an electrode located between the firstsubstrate end and the second substrate end and maintained at apredetermined potential; and a transparent conductive layer disposed ona side on which the outer surface is located, wherein the outer surfacecomprises a flat portion and a sloping portion formed from the flatportion to the second substrate end, the sloping portion slopes suchthat a thickness on a side on which the second substrate end is locatedis less than a thickness on a side on which the flat portion is located,and the transparent conductive layer overlaps the sloping portion and iselectrically connected to the electrode.
 2. The display device of claim1, further comprising a connection member which is in contact with theelectrode and the transparent conductive layer and electrically connectsthe electrode and the transparent conductive layer.
 3. The displaydevice of claim 2, wherein the transparent conductive layer is locatedbetween the sloping portion and the connection member.
 4. The displaydevice of claim 1, further comprising: an optical element; and anadhesive layer which bonds the optical element to the transparentconductive layer.
 5. The display device of claim 4, wherein an end ofthe optical element projects more toward the electrode than an end ofthe adhesive layer.
 6. The display device of claim 4, further comprisinga low expansion layer located between the adhesive layer and the opticalelement, wherein a thermal expansion coefficient of the low expansionlayer is less than a thermal expansion coefficient of the opticalelement.
 7. The display device of claim 1, further comprising an opticalelement, wherein the transparent conductive layer is a conductiveadhesive agent which bonds the optical element to the flat portion. 8.The display device of claim 7, wherein the transparent conductive layeris apart from the sloping portion above the sloping portion.
 9. Thedisplay device of claim 8, further comprising a conductive connectionmember which is in contact with the electrode and the transparentconductive layer.
 10. The display device of claim 7, wherein thetransparent conductive layer is in contact with the electrode.
 11. Thedisplay device of claim 1, further comprising an optical elementcomprising a main body and an extension portion, wherein the transparentconductive layer is an adhesive agent which bonds the main body to theflat portion and the sloping portion and bonds the extension portion tothe electrode.
 12. The display device of claim 1, wherein the slopingportion is formed in a substantially rectangular shape.
 13. The displaydevice of claim 1, wherein the sloping portion is formed in asubstantially triangular shape.
 14. The display device of claim 1,wherein the second insulating substrate comprises a concave portion, andthe sloping portion is disposed in the concave portion.
 15. The displaydevice of claim 2, wherein the connection member is formed of a resinmaterial having conductivity.
 16. The display device of claim 1, whereina width of the sloping portion is equal to a height of the slopingportion or greater than the height.
 17. The display device of claim 1,wherein a width of the sloping portion is less than a height of thesloping portion.
 18. The display device of claim 1, wherein a thicknessof the first insulating substrate is greater than a thickness of thesecond insulating substrate.